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Unlike PCs which have space for fans, smartphones don’t, which means that in order to keep cool, they use passive cooling like heatsinks designed to help dissipate heat when the phone is running hot. Of course, sometimes the phone gets too hot to the point where passive cooling can’t really help much.
This is why over the years, we’ve seen companies come up with liquid cooling technology in the form of vapor chambers. But now it seems that Infinix is taking things one step further with its latest 3D Vapour Cloud Chamber Liquid Cooling Technology.
For those unfamiliar with how a vapor chamber works, basically these components contain small amounts of moisture that are designed to evaporate when the phone gets hot, helping it cool down faster. These droplets then “move” to a cooler location of the phone where the process keeps repeating itself as many times as necessary.
What Infinix has done is that they have improved on the design of the vapor chamber by adding bumps to one side of the evaporator, which in turn helps to increase the overall volume and how much water can be stored. According to the company:
“Reducing the thermal resistance media of the heating source is realized by adjusting the structure of the front housing to form a bump, which enables the 3D Vapor Cloud Chamber to almost directly contact the SoC chip. This significantly reduces thermal resistance from shield to Vapor Chamber increasing thermal conductivity rate, performance, and heat dissipation.”
The company is expected to introduce this new cooling tech to its smartphones, which in theory should allow them to run cooler and maintain their processing power for longer periods of time.
Source: Infinix
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