MediaTek’s Dimensity 8300 is here to challenge Qualcomm’s Snapdragon 7 Gen 3

Earlier this month, MediaTek announced the Dimensity 9300 chipset. This is the company’s latest flagship chipset meant to compete against Qualcomm’s Snapdragon 8 Gen 3. But it looks like the company isn’t done with its announcements yet as they have since announced the Dimensity 8300.

The Dimensity 8300 features an octa-core CPU design which features four Arm Cortex-A715 cores and four Cortex-A510, which for context is a slightly different configuration compared to the Dimensity 9300. It also uses the Mali-G615 MC6 GPU which the company claims offers up to 60% improved performance over its predecessor, and 55% more power efficiency.

MediaTek has positioned the Dimensity 8300 as a “premium-tier” chipset and that it will also come with features like AI support, thanks to the use of the APU 780 AI processor that has been integrated into the chipset. It will support full generative AI and large language models up to 10B, as well as stable diffusion.

Of course, it should be noted that handset makers and developers will need to take advantage of this hardware as the AI won’t come bundled with the chipset, but it will be capable enough of running AI-based software should handset makers choose to include it with their phones.

Also, with the use of the APU, combined with MediaTek’s 14-bit HDR-ISP Imagiq 980, it will allow for better smartphone photos and videos, like being able to take sharper and clearer 4K videos at 60 fps for longer periods of time. The Dimensity 8300 will also offer up 5G connectivity where the built-in modem will support 3CC carrier aggregation for faster download speeds.

MediaTek claims that we should be able to expect to see devices powered by the Dimensity 8300 by the end of 2023. Its predecessor was used by brands like Oppo, Vivo, and iQOO, just to name a few, so we should expect to see some upper mid-ranged phones from those brands using MediaTek’s latest chipset.