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As the battle for Arm dominance continues, we’re bound to see the launch of newer and more powerful chips across different device form factors from big players in the industry. Take for example MediaTek’s newest Dimensity 7300 and 7300X SoCs, the company’s latest expansion to its 4nm Dimensity series processors.
While they are named somewhat similarly, there are key distinctions as to how they’ll power upcoming smart devices. MediaTek says that both are designed to provide devices with seamless multitasking, photography, AI functions and gaming capabilities, although the Dimensity 7300X takes things one step further, as it’s specially-designed to work with flip-style foldable devices.
Inside, both chipsets pack an octa-core CPU consisting of 4X Arm Cortex-A78 cores, which operate at up to 2.5GHz and are paired with 4X Arm Cortex-A55 cores. The 4nm process provides up to 25% lower power consumption in the A78 cores compared to older models such as the Dimensity 7050.
MediaTek adds that the CPU works with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations for accelerated gaming performance, with the Dimensity 7300 series offering 20% faster FPS and 20% improved energy efficiency versus competing products. The new chips also feature smart resource optimization, 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.
For photography, the Dimensity 7300 chipsets also pack the MediaTek Imagiq 950, which consists of a 12-bit HDR-ISP with support for cameras at up to 200MP resolution. Also included are noise reduction (MCNR), face detection (HWFD), and video HDR features, as well as live focus photo performance. The 7300 duo also supports 4K HDR video recording with over 50% wider dynamic range, versus most competitors.
For device displays, the new Dimensity 7300 chips feature support for WFHD+ displays with 10-bit true color, along with support for global HDR standards.
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